The global HDI output value is expected to reach US$24.63 billion in 2025, with a compound annual growth rate of 12.8%
The increasing miniaturization of electronic devices, the rapid tendency of consumers to smart devices, the significant growth of consumer electronics and the increasing adoption of car safety measures are driving the market's gradual growth. In addition, the increasing popularity of smart wearable devices may also drive demand for high-density interconnect PCBs during the forecast period. However, the high cost coupled with the lack of expertise in manufacturing HDI printed circuit boards is expected to hinder market growth during the 2019-2025 period.
High-density interconnect PCBs are a development in printed circuit board manufacturing technology that helps to create higher circuit densities than traditional PCBs. HDI printed circuit boards can place more components on both sides of the PCB, significantly increasing signal transmission speed and reducing signal loss. In addition, it provides faster routing, minimizes frequent relocation of components, and utilizes less space. In addition, it is designed to reduce size and improve the electrical performance of embedded devices.
It is estimated that the compound annual growth rate of the 12-layer and above layers is the highest during the forecast period. Segment growth is attributed to the increasing deployment of HDI printed circuit boards in many applications, such as mobile devices, automotive products, and more.
Depending on the application, the smartphone and tablet segment will dominate the market in 2018 and is expected to maintain its dominant position between 2019 and 2025.
Depending on the end use, the consumer electronics division is expected to dominate the market in 2018, and the industrial electronics sector is likely to be the fastest growing segment of the forecast period.
With the growing demand for high-density printed circuit boards in many end applications, the dramatic increase in consumer electronics sales may drive market growth. In addition, the lightweight and high performance of HDI printed circuit boards make them suitable for powering wearable devices. In addition, HDI printed circuit boards combine advanced features such as blind vias and microvias to maximize board space while improving performance and functionality. In addition, the increasing trend of autonomous driving and complex safety systems is creating more opportunities for demand during the forecast period.
Geographically, the global HDI printed circuit board market is divided into North America, Asia Pacific, Europe, Middle East and Africa, and Central and South America. North America occupied the largest market share in 2018 due to the popularity of smart wearables and the growing demand for HDI printed circuit boards in the automotive industry. However, the Asia Pacific region is likely to be the fastest growing region in the HDI printed circuit board market and is expected to dominate the market between 2019 and 2025. The existence of major electronics and semiconductor manufacturers and the rapid expansion of telecommunications networks in emerging economies are expected to increase market growth during the forecast period.