5G Requires Comprehensive Improvement of PCB Technology

 NEWS     |      2019-05-24 16:18


5G Requires Comprehensive Improvement of PCB Technology


While 5G brings opportunities to the PCB industry, it also puts higher and more stringent requirements on technology. Its indicators in terms of speed, integration, heat dissipation, frequency and multi-layering are much higher than 4G.

 

Full spectrum intervention, Massive MIMO and ultra-dense networks will be the core technology for implementing 5G networks. Accordingly, technical challenges have also been raised for PCBs. First, the base station radio unit and antenna have undergone major changes in structure and function, mainly because the number of radio unit channels increases (8 channels rise to 64 channels), corresponding PCB area increases; 4G base station equipment RRU plus antenna unit The structure is changed to a 5G AAU structure (integrated with RRU and antenna functions), which corresponds to a higher degree of PCB integration. Secondly, in order to achieve ultra-dense network coverage, in addition to spectrum applications below 6 GHz in the 5G spectrum, 28G, 39G and other millimeter-wave spectrum resources for hot-spot coverage and high-capacity high-speed transmission will be widely used. Therefore, high-frequency microwave base stations The demand for high frequency PCBs will increase. Finally, under the network architecture of 5G independent networking, in order to meet the technical requirements of high-speed transmission, the PCB required for data transmission equipment such as baseband unit, network board, backplane, server, etc. will use higher-level high-speed copper clad material. . "These technical challenges require domestic PCB companies to constantly grasp the technology and market trends and take the road of differentiation in order to build a unique competitive edge.

 

In addition, thermal management of PCB products may be particularly important in the future. "Not only the reasons for adapting to high-frequency devices, but also the heat dissipation requirements brought by high power and high power density. The application of new high thermal conductivity materials, special heat dissipation structure PCB requirements will appear." "Big data, cloud computing, etc. The required servers use high-level, high-reliability multi-layer boards; new technologies such as Internet of Things, intelligent manufacturing, and automatic driving, there will be some PCBs with special structures and special technical requirements, and special materials may be used. But it may also be a special structure different from the traditional PCB, or a PCB that requires much higher precision than the general level."